The standard recipes stored in the PLC memory can be individually modified and saved. In addition, our C1 machine includes various features designed to ensure optimum use of the compound and minimise operating costs. These features include a fill-level monitoring system and an integrated saturation/contamination sensor.
Key process parameters such as temperature, cycle times, and the contamination level of the compound are continuously recorded using a data logger. This ensures consistent processing results, effective quality control, and full compliance with industry requirements.
Key Features
- Fully automated removal of support structures and resin from photopolymers, such as PolyJet and SLA components
- Special software package enabling complete process programming
- Continuous monitoring of temperature and compound contamination levels
- Integrated grid with a drip edge for clean and safe operation
- Easy-to-use and easy-to-clean PLC display with a specially designed protective cover
Technical Specifications
- Internal dimensions of the processing chamber: 340 × 440 × 170 mm (W × L × H)
- Full chamber capacity: 62.5 litres
- Net machine weight: 185 kg
- Ambient temperature range: +5 to +40 °C
Electrical Connections
- Supply voltage: 230 V, 50 Hz, single phase, N/PE
- Control voltage: 24 V DC
Processable Workpiece Dimensions
- Minimum dimensions: 11 × 11 × 15 mm (W × L × H)
- Maximum dimensions: 340 × 440 × 170 mm (W × L × H)
